Logan Estridge

Appearances

Development of a new passivation coating to improve IC packaging reliability: From interfacial chemistry to pilot production
Date
August 13, 2023
Wire bonding interconnect is one of the most common packaging technologies due to its wide applicability, cost-effective and well-proven manufacturing process…
Presenter
Oliver Chyan
Professor, University of North Texas
Speakers
John Alptekin
Dinesh Kumaravel
Ashish Salunke
Logan Estridge
Kevin Antony