Dr. Oliver Chyan
Professor, University of North Texas
Professor Chyan's research program focuses on exploring critical underlying fundamental science to greatly facilitate microelectronic fabrication and functional nanostructure design development. Professor Chyan received his Ph.D. degree in materials chemistry from MIT. Since 1992, Chyan established the Interfacial Electrochemistry and Materials Research laboratory where he leads an interdisciplinary research team to investigate multitude of fundamental and applied research projects relevant to semiconductor processing and advanced microelectronic fabrication. In IC packaging area, Dr. Chyan's research team brings new insights on fundamental corrosion mechanism that causes failures of Cu wire Bonded on Al pad. Effective corrosion inhibition was demonstrated by strategically modifying the surface chemistry of Cu wires and/or Al pads. Dr. Chyan's research program was supported by Semiconductor Research Corporation and microelectronic company.
Appearances
DateAugust 24, 2022In a common Integrated Circuit (IC) packaging assembly, electrical interconnection is accomplished by fine Cu wires bonded to Al bonding pads microfabricated on an IC chip and external contact pins of the PCB board…Presenter
Professor, University of North Texas
DateAugust 13, 2023Wire bonding interconnect is one of the most common packaging technologies due to its wide applicability, cost-effective and well-proven manufacturing process…Presenter
Professor, University of North Texas
