Dinesh Kumaravel
Appearances
DateAugust 24, 2022In a common Integrated Circuit (IC) packaging assembly, electrical interconnection is accomplished by fine Cu wires bonded to Al bonding pads microfabricated on an IC chip and external contact pins of the PCB board…Presenter
Professor, University of North Texas- : [CHED] Division of Chemical Education
Speakers
Professor, University of KansasLouisiana Tech UniversityGraduate Student, Louisiana Tech UniversityBrigham Young UniversityAssistant Professor of Chemistry, University of Massachusetts BostonAssociate Professor, Ohio Northern UniversityN Carolina State UniversityProfessor and Welch Chair in Chemistry, University of North TexasProfessor, University of St ThomasUniversity of North TexasUniversity of North TexasBryan Nell, Ph.D.Assistant Professor of Chemistry, Ripon CollegeUndergraduate Researcher - : [CHED] Division of Chemical Education
Speakers
Professor, University of KansasLouisiana Tech UniversityGraduate Student, Louisiana Tech UniversityBrigham Young UniversityAssistant Professor of Chemistry, University of Massachusetts BostonAssociate Professor, Ohio Northern UniversityN Carolina State UniversityProfessor and Welch Chair in Chemistry, University of North TexasProfessor, University of St ThomasUniversity of North TexasUniversity of North TexasBryan Nell, Ph.D.Assistant Professor of Chemistry, Ripon CollegeUndergraduate Researcher - : [CHED] Division of Chemical Education
Speakers
Professor, University of KansasLouisiana Tech UniversityGraduate Student, Louisiana Tech UniversityBrigham Young UniversityAssistant Professor of Chemistry, University of Massachusetts BostonAssociate Professor, Ohio Northern UniversityN Carolina State UniversityProfessor and Welch Chair in Chemistry, University of North TexasProfessor, University of St ThomasUniversity of North TexasUniversity of North TexasBryan Nell, Ph.D.Assistant Professor of Chemistry, Ripon CollegeUndergraduate Researcher - DateMarch 27, 2023The corrosion mechanism of Aluminum bond pads in a chloride ion environment is reported and hydrogen evolution was found for the first time as the main cathodic reaction to drive rapid Al bond pad corrosion reaction, leading to fatal defects of Cu ball lift-offs…
DateAugust 13, 2023Wire bonding interconnect is one of the most common packaging technologies due to its wide applicability, cost-effective and well-proven manufacturing process…Presenter
Professor, University of North Texas
