3826880
Activated cleaning chemistries via megasonic energy for low-stress post-chemical mechanical planarization of SiC | Poster Board #1135
Date
March 26, 2023
Related Products
Basic Research in Colloids, Surfactants and Interfaces:
: [COLL] Division of Colloid & Surface Chemistry
Utilizing megasonic energy to enhance post-chemical mechanical planarization (p-CMP) cleaning for emerging substrates
As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…
Utilizing megasonic energy to enhance post-chemical mechanical planarization (p-CMP) cleaning for emerging substrates
As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…
Basic Research in Colloids, Surfactants and Interfaces:
: [COLL] Division of Colloid & Surface Chemistry