Kiana Cahue

As the demand for faster processing systems continues to grow, questions in regard to the limitations of current IC technology are being raised…

Chemical Mechanical Planarization (CMP) has emerged as a critical process step for achieving angstrom-level uniformity in advanced integrated circuit manufacturing and has ultimately led to the extension of Moore’s Law…

As the extension of Moore’s Law with current Silicon IC technology is approaching material limitations, Wide Band Gap (WBG) materials have gained interest…

As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…

Responsive biopolymeric nanocomposite systems can be synthesized from natural biopolymers (i.e., polysaccharides and cellulose), which take advantage of their well-defined, three-dimensional network and intrinsic properties…

As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…

: [COLL] Division of Colloid & Surface Chemistry

: [COLL] Division of Colloid & Surface Chemistry

Responsive biopolymeric nanocomposite systems can be synthesized from natural biopolymers (i.e., polysaccharides and cellulose), which take advantage of their well-defined, three-dimensional network and intrinsic properties…

: [COLL] Division of Colloid & Surface Chemistry

As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…

: [COLL] Division of Colloid & Surface Chemistry

: [COLL] Division of Colloid & Surface Chemistry

Responsive biopolymeric nanocomposite systems can be synthesized from natural biopolymers (i.e., polysaccharides and cellulose), which take advantage of their well-defined, three-dimensional network and intrinsic properties…

: [COLL] Division of Colloid & Surface Chemistry

As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…

: [COLL] Division of Colloid & Surface Chemistry

: [COLL] Division of Colloid & Surface Chemistry

Responsive biopolymeric nanocomposite systems can be synthesized from natural biopolymers (i.e., polysaccharides and cellulose), which take advantage of their well-defined, three-dimensional network and intrinsic properties…

: [COLL] Division of Colloid & Surface Chemistry

As integrated circuit and logic devices feature size continue to decrease to sub-3-nm nodes, it is imperative to limit induced defectivity during Chemical Mechanical Planarization (CMP) process (polishing and substrate cleaning)…

The manufacturing of Integrated Circuit (IC) technologies has been shifting focus to wide band gap (WBG) materials (i.e., Silicon carbide (SiC)) over the recent years. These WBG materials have shown promise as semiconductor materials due to the intrinsic properties (i.e…